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Patent Searching and Data


Title:
CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/033740
Kind Code:
A1
Abstract:
Provided is a conductive substrate which is provided with: a transparent base; a metal layer that is formed on at least one surface of the transparent base and has a first metal layer surface facing the transparent base and a second metal layer surface which is positioned on the reverse side of the first metal layer surface; and a blackened layer that is formed on the second metal layer surface. The surface roughness Ra of the second metal layer surface of the metal layer is from 0.01 μm to 0.1 μm (inclusive).

Inventors:
NOGUCHI MASASHI (JP)
NISHIYAMA YOSHIHIDE (JP)
Application Number:
PCT/JP2016/073456
Publication Date:
March 02, 2017
Filing Date:
August 09, 2016
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B15/04; G06F3/044; H01B5/14
Foreign References:
CN104749830A2015-07-01
JP2015158829A2015-09-03
US20150242011A12015-08-27
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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