Title:
CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/057262
Kind Code:
A1
Abstract:
Provided is a conductive substrate which comprises a transparent base, a metal layer that is formed on at least one surface of the transparent base, and a blackening layer that is formed on at least one surface of the transparent base. The blackening layer contains a simple substance of copper, a compound of copper and a simple substance and/or a compound of nickel. The compound of copper includes copper oxide and copper hydroxide. When the blackening layer is measured by X-ray photoelectron spectroscopy, if the sum of the peak area of copper oxide and the peak area of copper hydroxide as determined using the Cu 2P3/2 spectrum and the Cu LMM spectrum is taken as 100, the peak area of copper oxide is 40 or more and the peak area of copper hydroxide is 60 or less.
Inventors:
WATANABE TOMOHARU (JP)
Application Number:
PCT/JP2016/078245
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B3/24; B32B9/00; C23C14/06; C23C28/00; H01B5/14
Domestic Patent References:
| WO2015064664A1 | 2015-05-07 | |||
| WO2015115528A1 | 2015-08-06 |
Foreign References:
| JP2013129183A | 2013-07-04 | |||
| JP2015118743A | 2015-06-25 | |||
| JP2015153666A | 2015-08-24 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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