Title:
CONDUCTIVE TRANSFER MATERIAL, METHOD FOR MANUFACTURING PATTERNED SUBSTRATE, LAMINATE AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2020/137797
Kind Code:
A1
Abstract:
Provided are a conductive transfer material and applications thereof, the conductive transfer material including, in the following order: a temporary support; a first resin layer having a thickness of 1-300 nm; and a silver nanowire-containing layer.
Inventors:
TOYOOKA KENTARO (JP)
SUZUKI MASAYA (JP)
HIRAKI DAISUKE (JP)
SUZUKI MASAYA (JP)
HIRAKI DAISUKE (JP)
Application Number:
PCT/JP2019/049814
Publication Date:
July 02, 2020
Filing Date:
December 19, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; B32B7/025; B32B15/08; G06F3/041
Foreign References:
| JP2012033466A | 2012-02-16 | |||
| JP2016534465A | 2016-11-04 | |||
| JP2018128670A | 2018-08-16 | |||
| US20180301543A1 | 2018-10-18 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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