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Patent Searching and Data


Title:
CONDUCTOR, CONDUCTIVE COMPOSITION, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/017540
Kind Code:
A1
Abstract:
 The present invention pertains to a conductor comprising a base material and a conductive coating film laminated upon the base material, wherein the conductive coating film is formed from a conductive composition including a conductive polymer (A), and has a surface resistance value of 5X1010 Ω/□ or less, a surface roughness (Ra1 value) of 0.7 nm or less when measured using a contact-type step gauge, and a surface roughness (Ra2 value) of 0.35 nm or less when measured using an optical microscope. The present invention also pertains to a conductive composition comprising a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) includes a water-soluble polymer (C) having a nitrogen-containing functional group and a terminal hydrophobic group, and the content of compounds (D1) having an octanol-water partition coefficient (Log Pow) of 4 or greater within the conductive composition is 0.001 mass% or less relative to the total mass of the conductive composition.

Inventors:
FUKUDA HIROYA (JP)
NUMATA OSAMU (JP)
IKEDA HIRONOBU (JP)
NAGASAKA TOSHIO (JP)
SAIKI SHINJI (JP)
IRIYAMA HIROAKI (JP)
UZAWA MASASHI (JP)
KANEKO ASAKO (JP)
Application Number:
PCT/JP2013/070055
Publication Date:
January 30, 2014
Filing Date:
July 24, 2013
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
H01B1/12; C08F20/52; C08F26/06; C08L101/00; C09D5/24; C09D7/12; C09D139/04; C09D179/00; H01B5/14; H01B13/00
Domestic Patent References:
WO2012144608A12012-10-26
Foreign References:
JP2002226721A2002-08-14
JP2011208016A2011-10-20
JPH11203937A1999-07-30
JP2011219680A2011-11-04
JP2008038147A2008-02-21
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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