Title:
CONDUCTOR, CONDUCTIVE COMPOSITION, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/017540
Kind Code:
A1
Abstract:
The present invention pertains to a conductor comprising a base material and a conductive coating film laminated upon the base material, wherein the conductive coating film is formed from a conductive composition including a conductive polymer (A), and has a surface resistance value of 5X1010 Ω/□ or less, a surface roughness (Ra1 value) of 0.7 nm or less when measured using a contact-type step gauge, and a surface roughness (Ra2 value) of 0.35 nm or less when measured using an optical microscope. The present invention also pertains to a conductive composition comprising a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) includes a water-soluble polymer (C) having a nitrogen-containing functional group and a terminal hydrophobic group, and the content of compounds (D1) having an octanol-water partition coefficient (Log Pow) of 4 or greater within the conductive composition is 0.001 mass% or less relative to the total mass of the conductive composition.
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Inventors:
FUKUDA HIROYA (JP)
NUMATA OSAMU (JP)
IKEDA HIRONOBU (JP)
NAGASAKA TOSHIO (JP)
SAIKI SHINJI (JP)
IRIYAMA HIROAKI (JP)
UZAWA MASASHI (JP)
KANEKO ASAKO (JP)
NUMATA OSAMU (JP)
IKEDA HIRONOBU (JP)
NAGASAKA TOSHIO (JP)
SAIKI SHINJI (JP)
IRIYAMA HIROAKI (JP)
UZAWA MASASHI (JP)
KANEKO ASAKO (JP)
Application Number:
PCT/JP2013/070055
Publication Date:
January 30, 2014
Filing Date:
July 24, 2013
Export Citation:
Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
H01B1/12; C08F20/52; C08F26/06; C08L101/00; C09D5/24; C09D7/12; C09D139/04; C09D179/00; H01B5/14; H01B13/00
Domestic Patent References:
WO2012144608A1 | 2012-10-26 |
Foreign References:
JP2002226721A | 2002-08-14 | |||
JP2011208016A | 2011-10-20 | |||
JPH11203937A | 1999-07-30 | |||
JP2011219680A | 2011-11-04 | |||
JP2008038147A | 2008-02-21 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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