CONDUCTOR CONNECTION STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE COMPOSITION, AND ELECTRONIC COMPONENT MODULE

Title:

CONDUCTOR CONNECTION STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE COMPOSITION, AND ELECTRONIC COMPONENT MODULE

Document Type and Number:

WIPO Patent Application WO/2016/031619

Kind Code:

A1

Abstract:

Provided is a conductor connection structure (10) in which two conductors (21, 31) are electrically connected by a copper connection part (11). The connection part (11) comprises a material containing mainly copper. The connection part (11) also comprises a plurality of holes. An organosilicon compound is present within the holes. The connection part preferably has a structure in which a plurality of gathered particles are melted and bonded together and the particles have a necking section therebetween. In addition, the connection structure (10) preferably has a structure in which a plurality of large copper particles having a relatively large particle size and a plurality of small copper particles having a particle size smaller than that of the large copper particles are melted and bonded together such that the large copper particles and the small copper particles are bonded together, the small copper particles are bonded together, and a plurality of small copper particles are positioned around one large copper particle.

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Inventors:

KAMIKORIYAMA YOICHI (JP)
YAMAUCHI SHINICHI (JP)
YOSHIDA MAMI (JP)
NAKAYAMA SHIGEKI (JP)

Application Number:

PCT/JP2015/073092

Publication Date:

March 03, 2016

Filing Date:

August 18, 2015

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO (JP)

International Classes:

H01R4/02; H01B1/22; H01R11/01; H05K3/32

Domestic Patent References:

WO2012081255A1	2012-06-21
WO2006070747A1	2006-07-06

Foreign References:

JP2010065277A	2010-03-25
JPH08311347A	1996-11-26

Other References: