Title:
CONDUCTOR PATTERN FORMING METHOD AND CONDUCTOR PATTERN
Document Type and Number:
WIPO Patent Application WO/2011/052641
Kind Code:
A1
Abstract:
Provided is a conductor pattern formed base material, wherein the surface resistance thereof is lower than conventional base materials, and a conductor pattern with high conductivity is formed upon the base material, with high productivity. A receptive layer (5) is formed on the surface of the base material (4), using cellulose acetate alkylate. The conductor pattern (6) is formed by having conductive paste (3) printed on the surface of the aforementioned receptive layer (5) in a prescribed pattern.
Inventors:
KUWABARA, Shin (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
Application Number:
JP2010/069077
Publication Date:
May 05, 2011
Filing Date:
October 27, 2010
Export Citation:
Assignee:
PANASONIC ELECTRIC WORKS CO., LTD. (1048, Oaza-Kadoma Kadoma-sh, Osaka 86, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
International Classes:
H05K3/38; B05D5/12; B32B7/02; B32B23/20; B41M1/10; B41M1/30; H01B5/14; H01B13/00; H05K3/12; H05K9/00
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (Hokuto Patent Attorneys Office, Umeda Square Bldg. 9F., 12-17, Umeda 1-chome, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)