Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTOR SUBSTRATE, STRETCHABLE WIRING BOARD, AND STRETCHABLE RESIN FILM FOR WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/216352
Kind Code:
A1
Abstract:
Disclosed is a stretchable wiring board which comprises a stretchable resin film and a conductor layer disposed on the stretchable resin film. The stretchable resin film comprises a rubber ingredient and a filler. The rubber ingredient may have been crosslinked.

Inventors:
SIM TANGYII (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
OGAWA TADAHIRO (JP)
Application Number:
PCT/JP2019/018440
Publication Date:
November 14, 2019
Filing Date:
May 08, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/02; C08L21/00; H05K1/03
Domestic Patent References:
WO2016080346A12016-05-26
Foreign References:
JP2017183328A2017-10-05
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: