Title:
CONDUCTOR SUBSTRATE, WIRING SUBSTRATE, STRETCHABLE DEVICE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/216425
Kind Code:
A1
Abstract:
Provided is a conductor substrate having a stretchable resin layer and a conductor foil provided on the stretchable resin layer, wherein the stretchable resin layer contains a cured product of a resin composition containing: (A) a rubber component, (B) a crosslinking component having an epoxy group, and (C) an ester-based curing agent.
Inventors:
OGAWA TADAHIRO (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
SIM TANGYII (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
SIM TANGYII (JP)
Application Number:
PCT/JP2019/018795
Publication Date:
November 14, 2019
Filing Date:
May 10, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B15/08; C08K5/00; C08K5/10; C08L21/00; C08L63/00; H05K1/02; H05K1/03; H05K1/09
Domestic Patent References:
| WO2018016534A1 | 2018-01-25 |
Foreign References:
| JP2007112848A | 2007-05-10 | |||
| JP2007051258A | 2007-03-01 | |||
| JP2007211143A | 2007-08-23 | |||
| JP2008195846A | 2008-08-28 | |||
| JP2018024774A | 2018-02-15 | |||
| JP2006059999A | 2006-03-02 | |||
| JP2012122046A | 2012-06-28 | |||
| JP2011233622A | 2011-11-17 | |||
| JP2015067797A | 2015-04-13 | |||
| US20170092897A1 | 2017-03-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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