Title:
CONFIGURABLE MEMORY DIE CAPACITANCE
Document Type and Number:
WIPO Patent Application WO/2021/035626
Kind Code:
A1
Abstract:
Methods, systems, and devices for configurable memory die capacitance are described. A memory device may include a capacitive component, which may include one or more capacitors and associated switching components. The capacitive component may be coupled with an input/output (I/O) pad and an associated input buffer, and the one or more capacitors of the capacitive component may be selectively couplable with the I/O pad via the switching components. Switching components may be activated individually, in coordination, or not at all, such that one, multiple, or none of the capacitors may be coupled with the I/O pad. The capacitive component, I/O pad, and input buffer may be included in a same die of the memory device. In some cases, a configuration of the capacitive component may be based on signaling received from a host device.
Inventors:
CHENG JINGWEI (US)
ZHANG CHENG (US)
ZHANG CHENG (US)
Application Number:
PCT/CN2019/103342
Publication Date:
March 04, 2021
Filing Date:
August 29, 2019
Export Citation:
Assignee:
MICRON TECHNOLOGY INC (US)
International Classes:
G11C11/401
Foreign References:
| CN104299640A | 2015-01-21 | |||
| CN109062860A | 2018-12-21 | |||
| CN208623338U | 2019-03-19 | |||
| US20190252385A1 | 2019-08-15 |
Other References:
See also references of EP 4022615A4
Attorney, Agent or Firm:
LEE AND LI - LEAVEN IPR AGENCY LTD. (CN)
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