CONFINEMENT OF FOAM DELIVERED BY A PROXIMITY HEAD

Title:

CONFINEMENT OF FOAM DELIVERED BY A PROXIMITY HEAD

Document Type and Number:

WIPO Patent Application WO/2010/062918

Kind Code:

A3

Abstract:

In an example embodiment, a linear wet system includes a carrier and a proximity head in a chamber. The proximity head includes three sections in a linear arrangement. The first section suctions liquid from the upper surface of a semiconductor wafer as the wafer is transported by the carrier under the proximity head. The second section is configured to cause a film (or meniscus) of cleaning foam which is a non-Newtonian fluid to flow onto the upper surface of the wafer. The third section is configured to cause a film of rinsing fluid to flow onto the upper surface of the wafer as the wafer is carried under the proximity head. The third section is defined partially around the second section and up to the first section, so that the third section and the first section create a confinement of the cleaning foam with respect to the chamber.

Inventors:

KHOLODENKO ARNOLD (US)
LIN CHENG-YU SEAN (US)
GINZBURG LEON (US)
MANDELBOYM MARK (US)
TOMASCH GREGORY A (US)
HUSAIN ANWAR (US)

Application Number:

PCT/US2009/065812

Publication Date:

August 12, 2010

Filing Date:

November 24, 2009

Export Citation:

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Assignee:

LAM RES CORP (US)
KHOLODENKO ARNOLD (US)
LIN CHENG-YU SEAN (US)
GINZBURG LEON (US)
MANDELBOYM MARK (US)
TOMASCH GREGORY A (US)
HUSAIN ANWAR (US)

International Classes:

H01L21/302

Domestic Patent References:

WO2008097438A1

2008-08-14

Foreign References:

JP2007208247A	2007-08-16
US7350316B2	2008-04-01

Attorney, Agent or Firm:

PITINGA, David (LLP710 Lakeway Drive, Suite 20, Sunnyvale CA, US)

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