Title:
CONNECTED BODY VAPOUR CHAMBER HEAT SINK AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/153111
Kind Code:
A1
Abstract:
Disclosed are a connected body vapour chamber heat sink and an electronic device. The connected body vapour chamber heat sink is used for providing heat dissipation for at least two heat-emitting elements on a single board. The connected body vapour chamber heat sink comprises a first heat-dissipating plate (10), a second heat-dissipating plate (20) and a connecting part (30), wherein a first vapour chamber (11) is provided in the first heat-dissipating plate, a second vapour chamber (21) is provided in the second heat-dissipating plate, a channel (31) is provided in the connecting part, and the channel communicates between the first vapour chamber and the second vapour chamber. The connecting part can deform under force, meaning that the relative height between the first heat-dissipating plate and the second heat-dissipating plate changes to suit different mounting tolerances between heat-emitting elements, thereby realising a uniform temperature between heat-emitting elements.
Inventors:
LIU TENGYUE (CN)
CHI SHANJIU (CN)
ZENG WENHUI (CN)
CHI SHANJIU (CN)
ZENG WENHUI (CN)
Application Number:
PCT/CN2017/106549
Publication Date:
August 30, 2018
Filing Date:
October 17, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/367; F28D15/04; G06F1/20; H01L23/427
Foreign References:
| CN106887419A | 2017-06-23 | |||
| CN2610491Y | 2004-04-07 | |||
| CN102790021A | 2012-11-21 | |||
| CN1885530A | 2006-12-27 |
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