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Patent Searching and Data


Title:
CONNECTING MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/086453
Kind Code:
A1
Abstract:
A connecting material is provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load, can further suppress thickness variation in the connection part to ensure heat radiation performance, and can improve connection strength. This connecting material is used to form the connection portion that connects two members to be connected, and the connecting material contains particles and metal atom-containing particles. The aforementioned particles are used in order to form a connection portion such that the thickness of the connection portion after connection is less than or equal to twice the average particle diameter of the particles before connection, or, the particles have an average particle diameter of 1-300μm, the particles have a 10% K value of greater than 3000 N/mm2 and less than or equal to 20000 N/mm2, and the particles have a particle diameter CV value of 10% or less.

Inventors:
YAMAGAMI MAI (JP)
HANEDA SATOSHI (JP)
WAKIYA TAKESHI (JP)
YAMADA YASUYUKI (JP)
UEDA SAORI (JP)
SASADAIRA MASAO (JP)
Application Number:
PCT/JP2016/084308
Publication Date:
May 26, 2017
Filing Date:
November 18, 2016
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; B22F1/10; B22F1/18; B22F7/08; B23K35/24; C08F12/36; C08F16/32; C08F30/08; C08F36/08; C08J3/12; C09J9/02; C09J11/00; C09J11/08; H01B1/00; H01B1/22; H01B5/00; H01R11/01; B22F1/05; B22F1/052
Foreign References:
JP2012209097A2012-10-25
JP2012216530A2012-11-08
JP2014029855A2014-02-13
JP2016015256A2016-01-28
Other References:
See also references of EP 3378915A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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