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Patent Searching and Data


Title:
CONNECTING STRUCTURE FOR SUPERCONDUCTING WIRE MATERIAL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/099029
Kind Code:
A1
Abstract:
To provide both low connection resistance and high quenching resistance, this connecting structure connects a first superconducting multicore wire material and a second superconducting multicore wire material, which have structures wherein a plurality of superconducting filaments is covered by a stabilization material . In this connecting structure, either or both of the first and second superconducting multicore wire materials are a superconducting wire material for the passage of alternating current or for a persistent current switch. The tip region of a first superconducting filament exposed by removing the base material of the first superconducting multicore wire material and the tip region of a second superconducting filament exposed by removing the base material of the second superconducting multicore wire material form a crimp-connected junction part. The remaining region of the exposed first superconducting filament and the remaining region of the exposed second superconducting filament form a bypass part connected via a coating member. The coating member is formed from a metal material with electrical resistivity lower than the base material of the superconducting wire material for passage of alternating current or for a persistent current switch in the operating environment for the connection structure.

Inventors:
KODAMA MOTOMUNE (JP)
WAKUDA TSUYOSHI (JP)
Application Number:
PCT/JP2012/050644
Publication Date:
July 26, 2012
Filing Date:
January 16, 2012
Export Citation:
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Assignee:
HITACHI MEDICAL CORP (JP)
KODAMA MOTOMUNE (JP)
WAKUDA TSUYOSHI (JP)
International Classes:
H01R4/68; H01F6/06; H01L39/14; C22C9/06; H01B12/02; H01B13/00
Foreign References:
JP2009158234A2009-07-16
JP2008084547A2008-04-10
JP2001084852A2001-03-30
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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Claims: