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Patent Searching and Data


Title:
CONNECTION COMPONENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/169317
Kind Code:
A1
Abstract:
Disclosed is a connection component material that can be used, for example, for electrical contact components, such as connectors, lead frames, and harness plugs, used in electrical devices, electronic devices, etc. The connection component material comprises a Cu plating layer formed on a surface of a stainless steel plate, and a Sn plating layer formed on the Cu plating layer, the connection component material being characterized in that: the amount of adhesion of the Cu plating layer is from 1.5 to 45 g/m2; the amount of adhesion of the Sn plating layer is from 1.5 to 15 g/m2; and the surface hardness of the stainless steel plate is from 200 to 400 HV.

Inventors:
NISHIDA Yoshikatsu (4-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 66, 〒1008366, JP)
HIRAOKA Masashi (4-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 66, 〒1008366, JP)
NAGAO Masao (4-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 66, 〒1008366, JP)
FUJII Takahiro (4-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 66, 〒1008366, JP)
Application Number:
JP2017/006530
Publication Date:
October 05, 2017
Filing Date:
February 22, 2017
Export Citation:
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Assignee:
NISSHIN STEEL CO., LTD. (4-1 Marunouchi 3-chome, Chiyoda-ku Tokyo, 66, 〒1008366, JP)
International Classes:
C25D7/00; C25D5/10; C25D5/26; H01R13/03; H01R43/16
Foreign References:
JP2003203534A2003-07-18
JP2004172281A2004-06-17
JP2005105419A2005-04-21
JP2013161526A2013-08-19
Attorney, Agent or Firm:
AKAMATSU Yoshihiro (12-15 Nishinakajima 3-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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