Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONNECTION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/047671
Kind Code:
A1
Abstract:
Provided is a connection material capable of obtaining low connection resistance. The connection material contains conductive particles which comprise: resin particles; a first conductive film that covers the resin particles; multiple protruding core materials which are disposed on the first conductive film and which have a Vickers hardness of 1,500 to 5,000; and a second conductive film that covers the first conductive film and protruding core materials. The minimum melt viscosity of the connection material is 1 to 100,000 Pa·s. Due to this configuration, low connection resistance can be obtained because a binder is thoroughly removed from between the conductive particles and an electrode, and a sufficient amount of the pressure applied to the electrode can be obtained.

Inventors:
FUKAYA TATSURO (JP)
ISHIMATSU TOMOYUKI (JP)
Application Number:
PCT/JP2016/077197
Publication Date:
March 23, 2017
Filing Date:
September 14, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; H01B1/00; H01B1/22
Domestic Patent References:
WO2012098929A12012-07-26
WO2010010768A12010-01-28
Foreign References:
JP2015057757A2015-03-26
JP2011175846A2011-09-08
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
Download PDF: