Title:
CONNECTION MODULE
Document Type and Number:
WIPO Patent Application WO/2021/049435
Kind Code:
A1
Abstract:
Provided is a connection module (80) to which a plurality of constituent devices in a refrigeration cycle (10) are connected, the connection module having a main body (81) having a refrigerant flow path (82) formed therein. The refrigerant flow path constitutes a part of a refrigerant flow path in the refrigeration cycle. The refrigerant flow path has a high temperature-side flow path (82a) and a low temperature-side flow path (82b). The high temperature-side flow path is formed with a connection port (83a) to which, among the plurality of constituent devices, a high temperature-side constituent device (12) in which a high pressure refrigerant of the refrigeration cycle circulates is connectable. The low temperature-side flow path is formed with a connection port (83f, 83g) to which, among the plurality of constituent devices, a low temperature-side constituent device (24) in which a refrigerant having a lower temperature than the high pressure refrigerant circulates is connectable.
Inventors:
MORIMOTO MASAKAZU (JP)
MIZUNO YASUHIRO (JP)
UCHIYAMA MASAKI (JP)
SUGIYAMA YUKI (JP)
MIZUNO YASUHIRO (JP)
UCHIYAMA MASAKI (JP)
SUGIYAMA YUKI (JP)
Application Number:
PCT/JP2020/033617
Publication Date:
March 18, 2021
Filing Date:
September 04, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F25B5/02; B60H1/32; F25B41/20; F25B41/40; F25B41/42
Domestic Patent References:
| WO2014046063A1 | 2014-03-27 | |||
| WO2016194145A1 | 2016-12-08 |
Foreign References:
| JP2004092734A | 2004-03-25 | |||
| JPH0611203A | 1994-01-21 | |||
| JP2019105422A | 2019-06-27 | |||
| JP2010281224A | 2010-12-16 |
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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