Title:
CONNECTION STRUCTURE, CIRCUIT CONNECTION MEMBER, AND ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/070208
Kind Code:
A1
Abstract:
The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt<0 at least at a point within t = 30°C to 12°C.
Inventors:
MORIJIRI TOMOKI (JP)
KUME MASAHIDE (JP)
TANAKA MASARU (JP)
TAKETATSU JUN (JP)
KUME MASAHIDE (JP)
TANAKA MASARU (JP)
TAKETATSU JUN (JP)
Application Number:
PCT/JP2017/034153
Publication Date:
April 19, 2018
Filing Date:
September 21, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01R11/01; C09J201/00
Foreign References:
| US5552092A | 1996-09-03 | |||
| JPH0323959A | 1991-01-31 | |||
| CN103626958A | 2014-03-12 | |||
| JP2007297597A | 2007-11-15 | |||
| JP2011175970A | 2011-09-08 | |||
| JP2003017149A | 2003-01-17 | |||
| JP2000500921A | 2000-01-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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