Title:
CONNECTION STRUCTURE CONNECTING HIGH FREQUENCY CIRCUIT AND WAVEGUIDE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2013/161279
Kind Code:
A1
Abstract:
[Problem] To provide: a new connection structure that connects a high frequency circuit and a waveguide, and enables standardization of a board aperture size without causing deterioration of a transmission path conversion characteristic; and a manufacturing method for said connection structure. [Solution] The invention comprises: a module board (1) on which the high frequency circuit (11) is mounted and that is provided with means (9, 7) of conversion of a transmission path to the waveguide (3); a waveguide conductor (8) in which the waveguide is formed; and a parent board (2) that is provided on the waveguide conductor and comprises an aperture of a size larger than an aperture size (d) of the waveguide. The module board is affixed to the parent board so as to cover the aperture of the parent board, and a choke is formed using a space among the module board, the parent board and the waveguide conductor.
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Inventors:
KAWATA MUNEYASU (JP)
Application Number:
PCT/JP2013/002730
Publication Date:
October 31, 2013
Filing Date:
April 23, 2013
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01P5/107; H01P1/04
Foreign References:
| JP2009296491A | 2009-12-17 | |||
| JP2009111837A | 2009-05-21 | |||
| JP4261726B2 | 2009-04-30 | |||
| JP2007336299A | 2007-12-27 |
Other References:
See also references of EP 2843759A4
Attorney, Agent or Firm:
KATSURAGI, YUJI (JP)
Yuji Katsuragi (JP)
Yuji Katsuragi (JP)
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