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Patent Searching and Data


Title:
CONNECTION STRUCTURE FOR ELECTRICAL WIRE AND METHOD FOR CONNECTING ELECTRICAL WIRE
Document Type and Number:
WIPO Patent Application WO/2020/080092
Kind Code:
A1
Abstract:
A harness 1, provided with: a plurality of copper electrical wires 10A provided with a copper core wire 11A, and a plurality of aluminum electrical wires 10B provided with an aluminum core wire 11B; and a bonding part 20 in which the plurality of copper core wires 11A and aluminum core wires 11B are bonded by ultrasonic welding. The bonding part 20 is provided with a first bonding layer 21 and a second bonding layer 22 disposed at the outermost position and a third bonding layer 23 disposed between the first bonding layer 21 and the second bonding layer 22. From among the plurality of copper core wires 11A and aluminum core wires 11B, the aluminum core wires 11B constituting the third bonding layer 23 has a conductor strength that is lower than that of the copper core wires 11A constituting the first bonding layer 21 and the second bonding layer 22.

Inventors:
KAWATA YUJI (JP)
MIYAMOTO KENJI (JP)
TAMAGAWA TATSUO (JP)
SHIRAI DAICHI (JP)
Application Number:
PCT/JP2019/038678
Publication Date:
April 23, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R4/02; B23K20/10; H01B7/00; H01R4/62; H01R43/02; H02G1/14; H02G15/08
Foreign References:
JP2017076497A2017-04-20
JP2019008900A2019-01-17
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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