Title:
CONNECTION STRUCTURE FOR CONNECTION ELECTRODE ON FLEXIBLE SUBSTRATE AND CONNECTION ELECTRODE OF FLEXIBLE IC, DISPLAY PANEL, AND CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/193927
Kind Code:
A1
Abstract:
Provided are a connection structure for an electrode on a flexible substrate and a connection electrode on a flexible IC, a connection method, and a display panel in which the same is used, with which it is possible to make a connection even when the amount of deformation of flexible substrates differs by lot. A connection structure for a connection electrode on a flexible substrate and a connection electrode on a flexible IC, the connection structure being such that the connection electrode on the flexible substrate, in which a plurality of first electrodes are disposed in a line on the flexible substrate, and the connection electrode of the flexible IC, in which a plurality of second electrodes are disposed in a line corresponding to the first electrodes on a different base material from the flexible substrate, are secured facing each other, wherein the pitch of the center line of the electrodes is fixed in the x direction and the pitch of the center line of the center line of the electrodes varies in the y direction.
Inventors:
ISHIZAKI MAMORU
TAKEI MANABU
TAKEI MANABU
Application Number:
PCT/JP2018/015193
Publication Date:
October 25, 2018
Filing Date:
April 11, 2018
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H05K3/34; G02F1/167; G09F9/00; G09F9/30; G09F9/37; H05K3/36; G02F1/16755
Foreign References:
JP2010177493A | 2010-08-12 | |||
JP2016075896A | 2016-05-12 | |||
JP2015204458A | 2015-11-16 | |||
JP2007240808A | 2007-09-20 | |||
JPH03200223A | 1991-09-02 | |||
JPS6388886U | 1988-06-09 |
Attorney, Agent or Firm:
OGASAWARA PATENT OFFICE (JP)
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