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Patent Searching and Data


Title:
CONNECTION STRUCTURE FOR FLEXIBLE ELEMENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/003098
Kind Code:
A1
Abstract:
A connection structure for a flexible element comprises: a flexible substrate (compliant substrate); and a columnar structured conductive layer which is formed on the flexible substrate and comprises a plurality of conductive columns which extend in a first direction perpendicular to the upper surface of the flexible substrate. When the flexible substrate extends in a second direction parallel to the upper surface of the flexible substrate, the columnar structured conductive layer has a conductive network structure having a plurality of openings defined by the plurality of conductive columns.

Inventors:
SUN JEONG YUN (KR)
OH KYU HWAN (KR)
LEE HAE RYUNG (KR)
Application Number:
PCT/KR2016/005502
Publication Date:
January 05, 2017
Filing Date:
May 25, 2016
Export Citation:
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Assignee:
UNIV SEOUL NAT R & DB FOUND (KR)
International Classes:
H01L23/538; H01L23/498; H01L51/00
Foreign References:
KR19990044804A1999-06-25
KR20120137441A2012-12-20
KR19980033041A1998-07-25
JPH1154927A1999-02-26
Other References:
YOON, JU IL ET AL.: "Remarkable Improvement of Stretch-ability of Ceramic Island on Polymer Substrates for Flexible Electronics", Retrieved from the Internet
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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