CONNECTION STRUCTURE OF FLEXIBLE SUBSTRATE AND BUS BAR, WIRING MODULE AND ELECTRICITY STORAGE MODULE

WIPO Patent Application WO/2020/255878

A1

A connection structure of a flexible substrate and a bus bar 21 according to the present disclosure is provide with a flexible substrate, a plurality of bus bars 21 and a connection piece 50; the flexible substrate is formed to be covered by a resin base material and a plurality of conducting paths 31 containing a first metal; the bus bars 21 are formed to contain a second metal; each conducting path 31 has a second conducting path 33 that extends from a first conducting path 32; the resin base material has a sub film part 46 that is branched from a main film part 41 and extends to the upper surfaces of the bus bars 21; the second conducting paths 33 are arranged on the sub film part 46; the connection piece 50 is formed to contain a third metal that achieves a higher bonding strength at welded parts with the first metal and the second metal than the bonding strength at a welded part of the first metal and the second metal; and the second conducting paths 33 and the bus bars 21 are bonded with the connection piece 50 by welding or brazing.

SUNAGA TAKAHIRO (JP)
HIRAMITSU HIROOMI (JP)
SATO YUTO (JP)

PCT/JP2020/023220

December 24, 2020

June 12, 2020

Click for automatic bibliography generation  

AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

H01M2/10; H01M2/20; H05K1/14; H05K3/36

JP2012226969A	2012-11-15
JP2011228216A	2011-11-10
JP2012190678A	2012-10-04
JPH02256158A	1990-10-16
JPS51134344A	1976-11-20

AKATSUKI UNION PATENT FIRM (JP)

View/Download PDF      PDF Help

Previous Patent: FLEXIBLE PRINTED CIRCUIT BOARD WITH TERMINAL, WIRING MODULE, AND ENERGY STORAGE MODULE

Next Patent: AIR DAMPER