Title:
CONNECTION STRUCTURE FOR SEMICONDUCTOR DEVICE, ULTRASONIC MODULE, AND ULTRASONIC ENDOSCOPE SYSTEM HAVING BUILT-IN ULTRASONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2014/091970
Kind Code:
A1
Abstract:
Provided is a connection structure for a semiconductor device, the structure enabling adhesive strength to be increased by means of a simple method without impacting on the properties of a semiconductor element. The connection structure for a semiconductor device, according to the present invention, is provided with: a silicon substrate which is sheet-shaped and comprises an external connection electrode on the surface thereof; a support member which is adhered to the rear surface of the silicon substrate, the adhesion surface of which has a columnar shape of substantially equal shape to the silicon substrate, and which is thicker than the silicon substrate; and a flexible substrate which internally comprises an inner lead that is connected to the external connection electrode, wherein the flexible substrate is arranged on the inner surface of the silicon substrate and is adhered to the support member by means of an adhesive.
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Inventors:
YAMADA JUNYA (JP)
Application Number:
PCT/JP2013/082506
Publication Date:
June 19, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H04R17/00; A61B8/00
Foreign References:
| JPH10201759A | 1998-08-04 | |||
| JP2010022931A | 2010-02-04 | |||
| JP2004363746A | 2004-12-24 | |||
| JP2011223468A | 2011-11-04 | |||
| JP2008028462A | 2008-02-07 | |||
| JP4100965B2 | 2008-06-11 | |||
| JP2009188802A | 2009-08-20 |
Other References:
See also references of EP 2934024A4
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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