Title:
CONNECTION STRUCTURE FOR A WIRING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/132570
Kind Code:
A1
Abstract:
The disclosed connection structure for a wiring material allows easy connection to a temperature detector. In said structure, a wiring material (11) is connected to a thermistor (14) that detects the temperature of a battery in a power-supply device. A connection end (13a) of a wiring material (11) comprising a flexible printed wiring substrate is placed in a wiring connection section (41) provided on the thermistor (14), and exposed lead parts (51) in the wiring connection section (41) are soldered to a circuit pattern (21) on the wiring material (11).
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Inventors:
IKEDA Tomohiro (())
池田 智洋 (())
SATO Katsunori (())
池田 智洋 (())
SATO Katsunori (())
Application Number:
JP2011/059101
Publication Date:
October 27, 2011
Filing Date:
April 12, 2011
Export Citation:
Assignee:
YAZAKI CORPORATION (4-28, Mita 1-chome Minato-k, Tokyo 33, 〒1088333, JP)
矢崎総業株式会社 (〒33 東京都港区三田１丁目４番２８号 Tokyo, 〒1088333, JP)
IKEDA Tomohiro (())
池田 智洋 (())
矢崎総業株式会社 (〒33 東京都港区三田１丁目４番２８号 Tokyo, 〒1088333, JP)
IKEDA Tomohiro (())
池田 智洋 (())
International Classes:
G01K7/00; H01M10/50; H01R12/59
Attorney, Agent or Firm:
HONDA Hironori et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims:
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