Title:
CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/049695
Kind Code:
A1
Abstract:
This connection structure (100) comprises a circuit board (1), an insulating member (3), a housing (2), and a conducting wire (4). The insulating member (3) includes a first section (3a) and a second section (3b). The first section (3a) is fixed to the circuit board (1). The second section (3b) is opposite to the first section (3a). The second section (3b) is fixed to the housing (2). The housing (2) includes a grounded contact (21). The conducting wire (4) electrically connects the circuit board (1) and the housing (2) while wound around the insulating member (3). The shortest distance, along the surface of the housing (2) from the position where the conducting wire (4) and the housing (2) are connected, to the contact (21), is shorter than the shortest distance along the surface of the housing (2) from the second section (3b) of the insulating member (3) to the contact (21).
Inventors:
MUKUNOKI YASUSHIGE (JP)
HORIGUCHI TAKESHI (JP)
SHIGETA HIROKI (JP)
HORIGUCHI TAKESHI (JP)
SHIGETA HIROKI (JP)
Application Number:
PCT/JP2020/033436
Publication Date:
March 10, 2022
Filing Date:
September 03, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
TOSHIBA MITSUBISHI ELECTRIC INDUSTRIAL SYSTEMS CORP (JP)
TOSHIBA MITSUBISHI ELECTRIC INDUSTRIAL SYSTEMS CORP (JP)
International Classes:
H05K7/14; H01R4/64; H01R12/55; H05K9/00
Foreign References:
| JP2003133779A | 2003-05-09 | |||
| JPH01135657U | 1989-09-18 | |||
| JPS5061705U | 1975-06-06 | |||
| US8854829B1 | 2014-10-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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