Title:
CONNECTOR-LINKED BOARD HAVING GATES CONNECTED IN PARALLEL, AND GATE DRIVE BOARD EQUIPPED WITH CONNECTORS FOR PARALLEL CONNECTION
Document Type and Number:
WIPO Patent Application WO/2018/016450
Kind Code:
A1
Abstract:
The present invention is a connector-linked board having gates connected in parallel and gate drive board equipped with connectors for parallel connection, said boards being for the purpose of allowing for the wire lengths between drive circuits and semiconductor elements to be equalized simply by connecting the electrodes of adjacent connectors, allowing for an increase or decrease in the number of semiconductor elements to be accommodated, when connecting a plurality of semiconductor elements to drive circuits in parallel. In the present connector-linked board having gates connected in parallel, a main connection board 1 is provided with a one-end connector 2, an other-end connector 3, a gate connection electrode 4, and an emitter connection electrode 5. A one-end outgoing wire connection electrode 11, one-end incoming wire connection electrode 12, and one-end output wire connection electrode 13 of the one-end connector 2 are respectively connected, by an outgoing connection wire 17, incoming connection wire 18, and output wire 19, to an other-end outgoing wire connection electrode 14, other-end incoming wire connection electrode 15, and other-end output wire connection electrode 16 of the other-end connector 3. The incoming connection wire 18 and the gate connection electrode are connected by an element connection wire 61. The output wire 19 and the emitter connection electrode 5 are connected by an output connection wire 71.
More Like This:
Inventors:
KAMACHI HARUKI (JP)
Application Number:
PCT/JP2017/025814
Publication Date:
January 25, 2018
Filing Date:
July 14, 2017
Export Citation:
Assignee:
ISAHAYA ELECTRONICS CORP (JP)
International Classes:
H02M1/08; H03K17/00
Foreign References:
| JP2004096829A | 2004-03-25 | |||
| JP2016195506A | 2016-11-17 |
Attorney, Agent or Firm:
EIWA PATENT FIRM (JP)
Download PDF: