Title:
CONNECTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2016/072403
Kind Code:
A1
Abstract:
A connector module (1) equipped with: a substrate (11) formed by laminating magnetic body layers and having a first main surface and a second main surface opposing one another; a surface-mounted connector (10) mounted on mounting electrodes (11A) provided on the first main surface of the substrate (11); external mounting electrodes (11B) provided on the second main surface of the substrate (11); and inductors (12) formed in the interior of the substrate (11), with a first end of the inductor being connected to a mounting electrode (11A) and a second end being connected to an external mounting electrode (11B). Thus, it is possible to provide a connector module wherein the labor involved in mounting an inductance element is eliminated, and space is saved.
Inventors:
YAZAKI HIROKAZU (JP)
Application Number:
PCT/JP2015/080983
Publication Date:
May 12, 2016
Filing Date:
November 04, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/06; H01F17/00; H01F27/29; H01R12/79; H05K1/16
Domestic Patent References:
| WO2014129279A1 | 2014-08-28 | |||
| WO2012153691A1 | 2012-11-15 |
Foreign References:
| JP2005229434A | 2005-08-25 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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