Title:
CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2014/068848
Kind Code:
A1
Abstract:
Provided is a connector, whereby airtightnes of an interior part of a chamber is preserved even if an interior part of a through hole which is formed in a substrate is not filled with a conductor such as solder, and simultaneously, reliable electrical connectivity may be obtained between the interior part and an exterior part of the chamber. A connector (1) comprises a multilayered substrate (10) which seals an aperture part (91) which is formed in a partition (90) and which joins an interior part and an exterior part of an airtight chamber (C). In the multilayered substrate (10), the interior surface side of a first through hole (23), which is formed in a first substrate (10), is closed by a second substrate (30), and a first conductive layer (24) which is connected to the interior surface side of a first conductive plating (22) is connected to an exterior surface side of a second conductive plating (32) of the second substrate (30). The exterior surface side of the first through hole (23) is sealed by a third substrate (40), and the second conductive layer (25) which is connected to the exterior surface side of the first conductive plating (22) is connected to the interior surface side of the third conductive plating (42) of the third substrate (40).
Inventors:
HASHIMOTO SHINICHI (JP)
UZAKI FUMIAKI (JP)
UZAKI FUMIAKI (JP)
Application Number:
PCT/JP2013/005909
Publication Date:
May 08, 2014
Filing Date:
October 03, 2013
Export Citation:
Assignee:
TYCO ELECTRONICS JAPAN G K (JP)
International Classes:
H01R12/52; H01R9/16; H05K3/46
Domestic Patent References:
| WO2012144326A1 | 2012-10-26 |
Foreign References:
| JPH07231165A | 1995-08-29 | |||
| JP2005259801A | 2005-09-22 | |||
| JP2009093806A | 2009-04-30 | |||
| JP2004349073A | 2004-12-09 | |||
| JPH1140223A | 1999-02-12 | |||
| JP2013012408A | 2013-01-17 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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