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Patent Searching and Data


Title:
CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2018/180581
Kind Code:
A1
Abstract:
Provided is a connector (1) in which molding failure is unlikely to occur during injection molding and which is capable of retaining a housing shape. The connector (1) has a housing (10) which is formed by a cured product of a thermosetting liquid silicone. The Vickers hardness of the cured product is set to 650 or higher. The housing (10) has a plurality of terminal housing chambers (101) that house terminals to be connected to electric wire terminals, partition walls (102) that are each located between adjacent terminal housing chambers (101), and a peripheral part (103) that constitutes the outer frame. Preferably, at least one of the partition walls (102) is formed to be thinner than the peripheral part (103).

Inventors:
HAMAGUCHI TAKAAKI (JP)
Application Number:
PCT/JP2018/010414
Publication Date:
October 04, 2018
Filing Date:
March 16, 2018
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R13/405; H01R13/504; H01R43/24
Domestic Patent References:
WO2011108679A12011-09-09
Foreign References:
JP2016035803A2016-03-17
JP2003026827A2003-01-29
JP2002008787A2002-01-11
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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