Title:
CONTACT PAD PRODUCTION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD USING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/163913
Kind Code:
A1
Abstract:
The production method according to the present invention comprises: a step for supplying, in a laminate in which layer pairs each having a wiring layer formed on an insulation layer form a stepped configuration, a catalyst solution on the top surfaces of the wiring layers that are exposed and that form the step portions in order to selectively apply a catalyst treatment thereto; and a step for applying electroless plating to the top surfaces of the wiring layers having the catalyst treatment applied thereon so as to cause metal layers to grow selectively.
Inventors:
YATSUDA KOICHI (JP)
HAYAKAWA TAKASHI (JP)
IWASHITA MITSUAKI (JP)
TANAKA TAKASHI (JP)
HAYAKAWA TAKASHI (JP)
IWASHITA MITSUAKI (JP)
TANAKA TAKASHI (JP)
Application Number:
PCT/JP2018/007230
Publication Date:
September 13, 2018
Filing Date:
February 27, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L27/11575; C23C18/16; H01L21/28; H01L21/288; H01L21/336; H01L21/768; H01L23/522; H01L27/11521; H01L27/11548; H01L27/11568; H01L29/788; H01L29/792
Domestic Patent References:
| WO2010050094A1 | 2010-05-06 |
Foreign References:
| JP2011035237A | 2011-02-17 | |||
| JP2013055136A | 2013-03-21 | |||
| JP2013058683A | 2013-03-28 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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