Title:
CONTACT PROBE AND SOCKET FOR SEMICONDUCTOR ELEMENT PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2013/084730
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a contact probe, and a socket for a semiconductor element provided with the contact probe for which conductor resistance is lowered and the amount of heat generated is reduced. A contact probe (10) is provided with a first plunger (12) having an upper contactor (14), a distal end of which is in contact with an electrode section of a semiconductor element; a second plunger (13) having a lower contactor (15) in contact with an electrode section of a substrate for inspection; and a coil spring (18) for urging the first plunger (12) and the second plunger (13) in a direction away from each other. At least the first plunger (12) and the second plunger (13) have a three-layered plating layer comprising an underlayer (22), an interlayer (23), and an outermost layer (24) on the surface of a base material (21). The interlayer (23) has a smaller volume resistivity than that of the outermost layer (24) and the outermost layer (24) has a higher degree of hardness than that of the interlayer (23).
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Inventors:
SUZUKI KATSUMI (JP)
SUZUKI TAKEYUKI (JP)
SUZUKI TAKEYUKI (JP)
Application Number:
PCT/JP2012/080383
Publication Date:
June 13, 2013
Filing Date:
November 22, 2012
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
G01R1/067; G01R31/26; H01R13/24; H01R33/76
Domestic Patent References:
| WO2011058646A1 | 2011-05-19 |
Foreign References:
| JP2011214965A | 2011-10-27 | |||
| JP2006098254A | 2006-04-13 | |||
| JP2000329790A | 2000-11-30 | |||
| JP2004503783A | 2004-02-05 |
Attorney, Agent or Firm:
TANI & ABE, p. c. (JP)
Patent business corporation A valley and Abe patent firm (JP)
Patent business corporation A valley and Abe patent firm (JP)
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