Title:
CONTACT SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/054155
Kind Code:
A1
Abstract:
This contact sensor module comprises: a column-like base part; a plurality of pressure-sensitive sensors attached on a tip of the base part; a flexible cover attached to the base part so as to cover the tip of the base part; and a hard intermediate member disposed between the tip of the base part and the cover. The pressure-sensitive sensor is attached to a surface of the base part in a state of being inclined so as to approach the center axis of the base part in the first direction from the base end side to the tip side of the base part. The intermediate member is formed so that an outer side wall surface of the intermediate member is in close contact with an inner side wall surface of the cover, and is formed so that the inner side wall surface of the intermediate member is in contact with the plurality of pressure-sensitive sensors and that a gap is formed between the intermediate member and the surface of the base part.
Inventors:
KAWASAKI JUN (JP)
SHIBUYA MASAKI (JP)
OKADA NORIMASA (JP)
SHIBUYA MASAKI (JP)
OKADA NORIMASA (JP)
Application Number:
PCT/JP2022/035330
Publication Date:
April 06, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
THK CO LTD (JP)
International Classes:
G01L5/1623
Foreign References:
| JP2013116546A | 2013-06-13 | |||
| US20140007700A1 | 2014-01-09 | |||
| US20200300598A1 | 2020-09-24 | |||
| JPS60221287A | 1985-11-05 | |||
| JP2018510805A | 2018-04-19 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
Download PDF: