Title:
CONTACT SHEET, PROBE, SEMICONDUCTOR WAFER TESTING APPARATUS, METHOD FOR PRODUCING CONTACT SHEET, AND METHOD FOR TESTING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2012/014331
Kind Code:
A1
Abstract:
A contact sheet (20) comprises: a contact ball (24) that has a core member (25) which is configured of a resin material, and a coating layer (26) which is configured of a metal material and covers the surface of the core member (25); and a pair of sheets (22, 23) that are respectively provided with through holes (221, 231) into which the contact ball (24) is inserted. The contact ball (24) is held between the pair of sheets (22, 23), while being inserted in the through holes (221, 231).
Inventors:
MIURA, Takeo (32-1 Asahicho 1-chome, Nerima-k, Tokyo 71, 〒1790071, JP)
三浦 武雄 (〒71 東京都練馬区旭町一丁目３２番１号 株式会社アドバンテスト内 Tokyo, 〒1790071, JP)
三浦 武雄 (〒71 東京都練馬区旭町一丁目３２番１号 株式会社アドバンテスト内 Tokyo, 〒1790071, JP)
Application Number:
JP2010/064823
Publication Date:
February 02, 2012
Filing Date:
August 31, 2010
Export Citation:
Assignee:
ADVANTEST Corporation (32-1, Asahicho 1-chome Nerima-k, Tokyo 71, 〒1790071, JP)
株式会社アドバンテスト (〒71 東京都練馬区旭町一丁目３２番１号 Tokyo, 〒1790071, JP)
MIURA, Takeo (32-1 Asahicho 1-chome, Nerima-k, Tokyo 71, 〒1790071, JP)
株式会社アドバンテスト (〒71 東京都練馬区旭町一丁目３２番１号 Tokyo, 〒1790071, JP)
MIURA, Takeo (32-1 Asahicho 1-chome, Nerima-k, Tokyo 71, 〒1790071, JP)
International Classes:
H01L21/66; G01R1/073
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (Hoshino Dai-ichi Bldg, 8-3 Nishishinjuku 8-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
Claims:
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