Title:
CONTACT AND SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/032318
Kind Code:
A1
Abstract:
The present invention relates to a hybrid contact and a socket device for testing a semiconductor device, and the hybrid contact of the present invention comprises: a first contact unit integrally formed by rolling, into a cylindrical shape, a strip pattern having a predetermined form formed by punching a metal plate, a second contact unit insertively positioned in the first contact unit and having conductivity and elasticity, and a molding unit, formed from an elastic material having insulation properties, for integrally fixing the first contact unit and the second contact unit; compensates for disadvantages of general pin type and rubber type contacts so as to facilitate optimization of mechanical characteristics and electrical characteristics according to the requirements of a test device; and is suitable for testing of a fine pitch device.
Inventors:
HWANG DONG WEON (KR)
HWANG LOGAN JAE (US)
HWANG JAE BAEK (KR)
HWANG LOGAN JAE (US)
HWANG JAE BAEK (KR)
Application Number:
PCT/KR2018/012602
Publication Date:
February 13, 2020
Filing Date:
October 24, 2018
Export Citation:
Assignee:
HWANG DONG WEON (KR)
HWANG LOGAN JAE (US)
HWANG JAE BAEK (KR)
HICON CO LTD (KR)
HWANG LOGAN JAE (US)
HWANG JAE BAEK (KR)
HICON CO LTD (KR)
International Classes:
G01R1/073; G01R1/04; G01R1/067; G01R31/28
Foreign References:
| KR101860923B1 | 2018-05-24 | |||
| KR101193556B1 | 2012-10-22 | |||
| KR101266123B1 | 2013-05-27 | |||
| JP2016223996A | 2016-12-28 | |||
| KR20160084399A | 2016-07-13 |
Attorney, Agent or Firm:
LEE, Un Cheol (KR)
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