Title:
CONTACT WITH SOLDER AND METHOD FOR MANUFACTURING THE CONTACT
Document Type and Number:
WIPO Patent Application WO/2008/053899
Kind Code:
A1
Abstract:
Contacts (10, 20) are formed of a metal thin plate including base sections (11,
21), elastic deformation sections (12, 22) and contact sections (13, 23). Recessed
sections (15, 25) are formed on the bottom surface of the base section, and a plurality
of through holes (16, 26, 27) are arranged above the recessed sections in parallel
to the bottom surface of the base section by penetrating the base section. The
method for manufacturing the contacts includes a step of preparing the contacts,
and a step of making the through holes formed on the contacts hold solder. Desired
contacts (10a, 20a) with solder are formed by such manufacturing method. Furthermore,
the solder is a solder ball (90), and the step of having the solder held includes
a step of preparing the solder ball and a step of press-fitting the solder ball
in the through hole.
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Inventors:
NAKAMURA YUJI (JP)
Application Number:
PCT/JP2007/071147
Publication Date:
May 08, 2008
Filing Date:
October 30, 2007
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
NAKAMURA YUJI (JP)
NAKAMURA YUJI (JP)
International Classes:
B23K1/00; B23K3/06; G01R1/073; H01L21/66; B23K101/38
Foreign References:
| JP2002164104A | 2002-06-07 | |||
| JP2002283049A | 2002-10-02 |
Attorney, Agent or Firm:
TANI, Yoshikazu et al. (Akasaka 2-chome Minato-k, Tokyo 52, JP)
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