CONTACTLESS APPLICATION OF AN ADHESIVE

WIPO Patent Application WO/2011/113906

A3

The invention relates generally to adhesives for application to a substrate and more particularly to condensation adhesives for contactless application to a wood substrate, such as laminate beams. Particularly, the system and method for applying an adhesive to a substrate, in particular a finger surface, of a substrate, comprising: - providing a contactless application device comprises at least 2 nozzles for ejecting adhesive onto the substrate without contacting the substrate, - providing a modified adhesive comprising - a condensation resin selected from the group of urea formaldehyde (UF) resin, melamine formaldehyde resin (MF), modified melamine formaldehyde resin (xMF) and phenol resorcinol formaldehyde resin (PRF) or combinations thereof, - optionally a hardener, wherein the adhesive rheology is modified by at least one of the following measures: - cooling to a temperature between 5 and 15 °C, preferably 5 to 10°C - including into the adhesive a viscosity increasing substance - including a thixotropic increasing substance in an effective amount to prevent sagging of the adhesive from the finger surface.

MANNSVERK GEIR OVE (NO)
MOERLAND EINAR (NO)
GROESTAD KRISTIN (NO)
BJOERN TRANA (NO)

PCT/EP2011/054075

January 26, 2012

March 17, 2011

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DYNEA OY (FI)
MANNSVERK GEIR OVE (NO)
MOERLAND EINAR (NO)
GROESTAD KRISTIN (NO)
BJOERN TRANA (NO)

C09J5/06; B27F1/16; B27G11/00

EP0949309A1	1999-10-13
EP1862277A1	2007-12-05

DATABASE WPI Week 199927, Derwent World Patents Index; AN 1999-321647, XP002664430

DERKS, Wilhelmus et al. (31st floorAmstelplein 1, HA Amsterdam, NL)

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