CONTACTLESS COMMUNICATION MODULE

Title:

CONTACTLESS COMMUNICATION MODULE

Document Type and Number:

WIPO Patent Application WO/2017/110273

Kind Code:

A1

Abstract:

The present invention provides a contactless communication module that enhances communication quality. The module M1 is equipped with a substrate 100, an antenna 200, a semiconductor component 300, an internal connection part 400, and an external connection part 500. A counterpart communication device is disposed at close range in the Z-direction of the substrate 100. The antenna 200 is provided at a first height position on the substrate 100 so as to enable contactless communication with the counterpart communication device. The semiconductor component 300 is provided at the first height position or a second height position on the substrate 100. The second height position is further in the Z'-direction than the first height position. The internal connection part 400 electrically connects the antenna 200 and the semiconductor component 300. A first part 510 of the external connection part 500 is provided to the substrate 100 and is electrically connected to the semiconductor component 300. A second part 520 of the external connection part 500 protrudes outward from the substrate 100.

Inventors:

KONDO HAYATO (JP)

Application Number:

PCT/JP2016/083078

Publication Date:

June 29, 2017

Filing Date:

November 08, 2016

Export Citation:

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Assignee:

HOSIDEN CORP (JP)

International Classes:

H04B5/02; H01L23/12; H01L23/50

Domestic Patent References:

WO2009142053A1

2009-11-26

Foreign References:

JP2006505973A	2006-02-16
JP2013021628A	2013-01-31
JP2002203224A	2002-07-19
JP2006262054A	2006-09-28
JPH0421203A	1992-01-24
JP2007133630A	2007-05-31
JPH07106463A	1995-04-21
JPS56137697A	1981-10-27
JPH11238103A	1999-08-31

Other References: