Title:
CONTACTLESS THICKNESS MEASUREMENT SYSTEM AND METHOD USING LASER
Document Type and Number:
WIPO Patent Application WO/2017/160082
Kind Code:
A1
Abstract:
The present invention relates to a contactless thickness measurement system and method using a laser and, more specifically, to a contactless thickness measurement system and method using a laser, the system comprising: a light emission unit for generating a laser by using a light source so as to emit the laser at an object; a reception unit for receiving a primary photo-acoustic signal generated by direct collision between the laser and the surface of the object and a secondary photo-acoustic signal generated while the laser is proceeding inside the object; a measurement unit for measuring response waveforms of the received primary photo-acoustic signal and secondary photo-acoustic signal; and an analysis unit for deriving the thickness of the object by analyzing response characteristics indicated by the measured response waveforms, wherein the thickness of the object can be measured by analyzing the tendency of the primary photo-acoustic signal and secondary photo-acoustic signal generated by emitting the laser at the object.
Inventors:
PARK KWAN KYU (KR)
PARK JUN HONG (KR)
CHOI WON YOUNG (KR)
PARK JUN HONG (KR)
CHOI WON YOUNG (KR)
Application Number:
PCT/KR2017/002804
Publication Date:
September 21, 2017
Filing Date:
March 15, 2017
Export Citation:
Assignee:
INDUSTRY-UNIV COOP FOUND HANYANG UNIV (KR)
International Classes:
G01B11/06; G01B17/02; H01S3/106
Foreign References:
| JP2002213936A | 2002-07-31 | |||
| JP2001091213A | 2001-04-06 | |||
| JP2001311615A | 2001-11-09 | |||
| JP2007322126A | 2007-12-13 | |||
| KR20130088916A | 2013-08-09 |
Attorney, Agent or Firm:
SHIM, Kyoung-Shik et al. (KR)
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