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Title:
CONTACTS AND TEST SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198853
Kind Code:
A1
Abstract:
The present invention relates to contacts and a socket apparatus for testing a semiconductor device. Each contact according to the present invention is a spring contact integrally formed by punching out and bending a metal plate, and comprises: an elastic part formed of various strips having certain patterns; and tip parts respectively provided on both ends of the elastic part. The volumetric space of a contact is preferably filled with a filler having conductivity and elasticity, such that the contact exhibits excellent durability and electrical characteristics. Also, the test socket according to the present invention is a rubber-type soket that employs said contact and is suitable for testing a device for fine pitches.

Inventors:
HWANG, Dong Weon (85 Dumil-ro 123beon-gil, Bundang-guSeongnam-si, Gyeonggi-do, 13544, KR)
HWANG, Jae Suk (2161 Allston way unit 202, Berkeley, California, 94704, US)
HWANG, Jae Baek (#74-503, 201 Apgujeong-ro,Gangnam-gu, Seoul, 06004, KR)
Application Number:
KR2018/004617
Publication Date:
October 17, 2019
Filing Date:
April 20, 2018
Export Citation:
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Assignee:
HWANG, Dong Weon (85 Dumil-ro 123beon-gil, Bundang-guSeongnam-si, Gyeonggi-do, 13544, KR)
HWANG, Jae Suk (2161 Allston way unit 202, Berkeley, California, 94704, US)
HWANG, Jae Baek (#74-503, 201 Apgujeong-ro,Gangnam-gu, Seoul, 06004, KR)
International Classes:
G01R1/067; G01R1/04; G01R1/073; G01R3/00; G01R31/28
Foreign References:
JP2016223996A2016-12-28
KR20170108522A2017-09-27
JP4921344B22012-04-25
JP2013205191A2013-10-07
KR101266123B12013-05-27
Attorney, Agent or Firm:
LEE, Un Cheol (5T International Patent Law Firm, #A-30125, Beobwon-ro 11-gil, Songpa-gu Seoul, 05836, KR)
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