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Patent Searching and Data


Title:
CONTAMINATION REMOVER
Document Type and Number:
WIPO Patent Application WO/2004/003987
Kind Code:
A1
Abstract:
A contamination remover for removing contamination adhered to the peripheral portion of the back or front surface and the edge of a semiconductor wafer, comprising a holding means having a rotary table for holding a semiconductor wafer and a rotary driving means for driving the rotary table, a peripheral portion abrading means having a ring-shaped or disk-shaped first abrasive pad whose end face acts on the peripheral portion of the upper surface of the semiconductor wafer held on the rotary table, an edge abrading means having a cylindrical second abrasive pad whose curved surface acts on the edge of the semiconductor wafer held on the rotary table, and an abrasive liquid supply means for supplying abrasive liquid on the upper surface of semiconductor wafer held on the rotary table.

Inventors:
Arai, Kazuhisa c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
Mitsui, Yshinori c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
Hayasaka, Hideki c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
Application Number:
PCT/JP2003/007768
Publication Date:
January 08, 2004
Filing Date:
June 19, 2003
Export Citation:
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Assignee:
DISCO CORPORATION (14-3, Higashi Kojiya 2-chome Ota-ku, Tokyo, 144-8650, JP)
Arai, Kazuhisa c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
Mitsui, Yshinori c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
Hayasaka, Hideki c/o DISCO CORPORATION (14-3 Higashi Kojiya 2-chom, Ota-ku Tokyo, 144-8650, JP)
International Classes:
B24B7/04; B08B1/04; B24B9/06; B24B27/00; B24B37/00; B24B37/04; B24B37/20; B24B37/24; B24B57/02; B24D7/10; H01L21/00; H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Ono, Hisazumi (Nippon Shuzo bldg, 1-21 Nishi-Shimbashi 1-chom, Minato-ku Tokyo, 105-0003, JP)
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