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Patent Searching and Data


Title:
CONTINUOUS PLATING PATTERNING ROLL AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/125972
Kind Code:
A1
Abstract:
Provided are a continuous plating patterning roll, which solves the problem of side etching and has excellent insulating layer adhesiveness, and a manufacturing method therefor. The continuous plating patterning roll is configured so as to be obtained by: coating a photoresist on the surface of a platable cylindrical metal substrate and exposing/developing same to form resist pattern sections and non-resist pattern sections; etching the cylindrical metal substrate of the non-resist pattern sections to form etched depressions; forming a DLC coating film on the etched depressions and the surface of the resist pattern sections; and peeling the DLC coating film formed on the resist pattern section from each resist pattern section and leaving the DLC coating film in the etched depressions.

Inventors:
SHIGETA, Tatsuo (1201-11, Takada, Kashiwa-sh, Chiba 25, 〒2778525, JP)
Application Number:
JP2014/052621
Publication Date:
August 21, 2014
Filing Date:
February 05, 2014
Export Citation:
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Assignee:
THINK LABORATORY CO., LTD. (1201-11, Takada Kashiwa-sh, Chiba 25, 〒2778525, JP)
International Classes:
C25D7/06; C23F1/00
Domestic Patent References:
WO2008081904A1
Foreign References:
JP2012154964A
JP2012169316A
JP2009093171A
JP2012184841A
JP2010053389A
JP2007224406A
JP2007000730A
Attorney, Agent or Firm:
ISHIHARA, Shinsuke et al. (p.c. 2F Segawa-Ikebukuro Bldg., 14-10, Minami-Ikebukuro 2-chome, Toshima-k, Tokyo 22, 〒1710022, JP)
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