Title:
CONTROL APPARATUS AND CONTROL PANEL
Document Type and Number:
WIPO Patent Application WO/2023/199481
Kind Code:
A1
Abstract:
This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the main circuit board (40). The second heating element (40b) is mounted to a rear surface (RS) of the main circuit board (40). The structure (ST) has a first protruding part (42a) and a second protruding part (20a). The first heat dissipation sheet (41) is sandwiched between the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is sandwiched between the second heating element (40b) and the second protruding part (20a). The first heat dissipation sheet (41) is in contact with the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is in contact with the second heating element (40b) and the second protruding part (20a).
Inventors:
OKURA KENICHIRO (JP)
OKUNO TOMOKI (JP)
TAKETOMI MASAKAZU (JP)
YAMADA TAKAHIRO (JP)
OKUNO TOMOKI (JP)
TAKETOMI MASAKAZU (JP)
YAMADA TAKAHIRO (JP)
Application Number:
PCT/JP2022/017843
Publication Date:
October 19, 2023
Filing Date:
April 14, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K7/20
Foreign References:
| JP2020088050A | 2020-06-04 | |||
| JP2004259948A | 2004-09-16 | |||
| JP2002217343A | 2002-08-02 | |||
| JP2009182182A | 2009-08-13 | |||
| JPH077183U | 1995-01-31 | |||
| JPH11163566A | 1999-06-18 | |||
| JP2020003973A | 2020-01-09 | |||
| JP2003086983A | 2003-03-20 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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