CONTROL PROGRAM, INFORMATION PROCESSING PROGRAM, CONTROL METHOD, INFORMATION PROCESSING METHOD, PLASMA PROCESSING DEVICE, AND IMAGE PROCESSING DEVICE

WIPO Patent Application WO/2024/019004

A1

Provided are a control program, an information processing program, a control method, an information processing method, a plasma processing device, and an image processing device.　The control program is for a plasma processing device which performs a plasma process by supplying source power to a plasma generation source, and supplying bias power to a mounting table on which a substrate to be processed is mounted, wherein the control program causes a computer to execute: a step for measuring a peak-to-peak voltage between the source power and the bias power; and a step for adjusting, as adjustment parameters for controlling a fluctuation width of the observed peak-to-peak voltage, the source power supplied to the plasma generation source, the bias power supplied to the mounting table, a DC voltage applied to an outer peripheral member disposed around the mounting table, and an impedance of a filter circuit connected between a supply source of the DC voltage and the outer peripheral member.

JP2003109939	ASHING DEVICE
JP6456400	Methods and equipment for surface treatment of substrates

TAKEDA RYOHEI (JP)
TAKAYAMA WATARU (JP)
OMI MUNEYUKI (JP)
YAEGASHI KEITA (JP)
TOMINAGA SHO (SG)
TAKAYOSHI JOJI (JP)

PCT/JP2023/026016

January 25, 2024

July 14, 2023

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TOKYO ELECTRON LTD (JP)

H01L21/3065; H05H1/46

JP2021176187A	2021-11-04
JP2011204971A	2011-10-13
JP2005011858A	2005-01-13
JPH10154697A	1998-06-09

KOHNO, Hideto et al. (JP)

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