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Title:
CONTROL SYSTEM OF DOUBLE-SIDED POLISHING DEVICE, CONTROL DEVICE, AND METHOD FOR PRODUCING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/002447
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.

Inventors:
KITAMOTO Hideo (JP)
FUJII Hirofumi (JP)
SHIOMICHI Yukimasa (JP)
SUGIMURA Osamu (JP)
Application Number:
JP2020/026117
Publication Date:
January 07, 2021
Filing Date:
July 03, 2020
Export Citation:
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Assignee:
TOYO KOHAN CO., LTD. (JP)
International Classes:
B24B37/08; B24B49/10; B24B49/16; H01L21/304
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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