Title:
CONVENIENT METHOD AND APPARATUS FOR ANALYZING SOLDER COMPONENT
Document Type and Number:
WIPO Patent Application WO/2004/044577
Kind Code:
A1
Abstract:
A convenient apparatus for analyzing solder component comprising means (1) for detecting the melting rate of a metallic member immersed into molten solder in a molten solder tank, and an processing means (2). Melting rate of the metallic member detected by the detecting means is processed by the processing means along with data of the kind, temperature, capacity of the molten solder and the thickness of the metallic member thus determining the element concentration of solder in the molten solder tank.
Inventors:
YOKOI SHIGEMI (JP)
Application Number:
PCT/JP2002/011858
Publication Date:
May 27, 2004
Filing Date:
November 14, 2002
Export Citation:
Assignee:
F AND S LTD (JP)
YOKOI SHIGEMI (JP)
YOKOI SHIGEMI (JP)
International Classes:
B23K3/06; (IPC1-7): G01N33/20; B23K1/00; B23K1/08; H05K3/34
Foreign References:
| JP2000121533A | 2000-04-28 | |||
| JPH07159395A | 1995-06-23 |
Attorney, Agent or Firm:
Igarashi, Kazutoshi (K.S Bldg. 5, Kojimachi 4-chom, Chiyoda-ku Tokyo, JP)
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