Title:
CONVEX CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/159883
Kind Code:
A1
Abstract:
The present invention provides a convex chip scale package comprising: a light emitting diode which provides blue light from a side surface and an upper surface thereof; a three-dimensional fluorescent layer which is disposed surrounding the side surface and the upper surface of the light emitting diode and which converts blue light emitted from the side surface and the upper surface of the light emitting diode into white light; and a convex unit which is formed in a semi-elliptical shape having a protruding center on the upper surface of a three-dimensional fluorescent layer, wherein the three-dimensional fluorescent layer is formed of a phosphor, the convex unit is formed of silicon, the thickness of the side surface of the three-dimensional fluorescent layer is formed uniformly, and the plane in which the convex unit is viewed from above may be circular.
Inventors:
MIN JAE-SIK (KR)
LEE JAE-YEOP (KR)
JANG JAE-YOUNG (KR)
CHO BYOUNG-GU (KR)
LEE JAE-YEOP (KR)
JANG JAE-YOUNG (KR)
CHO BYOUNG-GU (KR)
Application Number:
PCT/KR2017/002309
Publication Date:
September 07, 2018
Filing Date:
March 03, 2017
Export Citation:
Assignee:
LIGHTIZER KOREA CO LTD (KR)
International Classes:
H01L33/58; H01L33/00; H01L33/50
Domestic Patent References:
| WO2009117067A1 | 2009-09-24 | |||
| WO2007126836A2 | 2007-11-08 |
Foreign References:
| KR100712876B1 | 2007-04-30 | |||
| KR20050096510A | 2005-10-06 | |||
| KR20150112251A | 2015-10-07 |
Attorney, Agent or Firm:
JEON, Jong-Il (KR)
Download PDF: