Title:
COOLANT-BASED COOLING SYSTEM FOR THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT, AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/146039
Kind Code:
A1
Abstract:
A three-dimensional stacked integrated circuit that comprises interposers between integrated circuits of the three-dimensional stacked integrated circuit and below the lowermost integrated circuit. A coolant travel path is provided in each of the plurality of interposers, and the plurality of coolant travel paths that are provided in the plurality of interposers are connected to each other.
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Inventors:
TSUTSUI TAKASHI (JP)
IMANAKA SHIGENORI (JP)
FURUTANI TOMOHIKO (JP)
IMANAKA SHIGENORI (JP)
FURUTANI TOMOHIKO (JP)
Application Number:
PCT/JP2018/002310
Publication Date:
August 01, 2019
Filing Date:
January 25, 2018
Export Citation:
Assignee:
SOFTBANK CORP (JP)
International Classes:
H01L23/427; H01L23/473; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
WO2011030467A1 | 2011-03-17 |
Foreign References:
JPH08227953A | 1996-09-03 | |||
JP2014187228A | 2014-10-02 | |||
JP2015232500A | 2015-12-24 | |||
JP2009512215A | 2009-03-19 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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