Title:
COOLANT-BASED COOLING SYSTEM FOR THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT, AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/146212
Kind Code:
A1
Abstract:
A three-dimensional stacked integrated circuit that comprises interposers between integrated circuits of the three-dimensional stacked integrated circuit and below the lowermost integrated circuit. A coolant travel path is provided in each of the plurality of interposers, and the plurality of coolant travel paths that are provided in the plurality of interposers are connected to each other. Or, a three-dimensional stacked integrated circuit for which the configuration of a system has been simplified as a result of coolant interacting with the outside at every layer via grooves that are formed by immersion and provided to extend to the ends of interposers, which eliminates the need for a stacking-direction circuit for making the coolant circulate.
Inventors:
TSUTSUI TAKASHI (JP)
IMANAKA SHIGENORI (JP)
FURUTANI TOMOHIKO (JP)
IMANAKA SHIGENORI (JP)
FURUTANI TOMOHIKO (JP)
Application Number:
PCT/JP2018/041184
Publication Date:
August 01, 2019
Filing Date:
November 06, 2018
Export Citation:
Assignee:
SOFTBANK CORP (JP)
International Classes:
H01L23/427; H01L23/473; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2011030467A1 | 2011-03-17 | |||
| WO2012132019A1 | 2012-10-04 |
Foreign References:
| JPH08227953A | 1996-09-03 | |||
| JP2014187228A | 2014-10-02 | |||
| JP2015232500A | 2015-12-24 | |||
| US20170186728A1 | 2017-06-29 | |||
| US20100187683A1 | 2010-07-29 | |||
| JP2008159619A | 2008-07-10 | |||
| JP2013153083A | 2013-08-08 | |||
| JP2009099683A | 2009-05-07 | |||
| JP2016219733A | 2016-12-22 | |||
| JP2015226061A | 2015-12-14 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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