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Patent Searching and Data


Title:
COOLANT SYSTEMS FOR COMPUTING NODE
Document Type and Number:
WIPO Patent Application WO/2019/010605
Kind Code:
A1
Abstract:
Herein described are apparatuses, systems, and methods for coolant systems. A heat spreader (102) for a heat source (104) may include a first plate (106), wherein a portion (110) of the first plate (106) is to extend along the first side of the heat source (104). The first plate (106) may include a bend feature (112), wherein a first portion (114) of the bend feature (112) is to extend away from the heat source (104) and a second portion (116) is to extend toward the heat source (104). The heat spreader (102) may include a second plate (300), wherein a portion (302) of the second plate (300) is to extend along the second side of the heat source (104), and the second plate (300) includes a bend feature (316), wherein a first portion (322) of the bend feature (316) is to extend away from the heat source (104) and a second portion (324) is to extend toward the heat source(104).

Inventors:
DU LIGUANG (CN)
WANG DONG (CN)
XU XINGLONG (CN)
AOKI RUSSELL S (US)
JENSEN RALPH W (US)
Application Number:
PCT/CN2017/092359
Publication Date:
January 17, 2019
Filing Date:
July 10, 2017
Export Citation:
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Assignee:
INTEL CORP (US)
DU LIGUANG (CN)
WANG DONG (CN)
XU XINGLONG (CN)
AOKI RUSSELL S (US)
JENSEN RALPH W (US)
TATE ALAN W (US)
STEINBRECHER ROBIN A (US)
LIAO WEI (CN)
CHEN NA (CN)
YING GUOLIANG (CN)
International Classes:
F28F3/06
Domestic Patent References:
WO2008063121A12008-05-29
Foreign References:
EP2784812A22014-10-01
CN1453861A2003-11-05
CN104661494A2015-05-27
US20130299146A12013-11-14
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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