Title:
COOLER CASE ASSEMBLY AND METHOD FOR MANUFACTURING COOLER CASE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2015/111829
Kind Code:
A1
Abstract:
A cooler case assembly comprises: a cooler case, the interior of which is empty, and which has an opening on an end thereof; a hollow expansion module coupled to the opening of the cooler case; and a heat exchange assembly inserted into the cooler case through the expansion module.
More Like This:
| JPS5728986 | INDIRECT WATER HEATER AND MANUFACTURE THEREOF |
| JPS5929587 | [Title of the device] Heat exchange apparatus |
| WO/2000/017593 | HEAT EXCHANGER |
Inventors:
CHO HYOUNGWOOK (KR)
KIM JONGSOON (KR)
KIM HYERIM (KR)
KIM JONGSOON (KR)
KIM HYERIM (KR)
Application Number:
PCT/KR2014/010235
Publication Date:
July 30, 2015
Filing Date:
October 29, 2014
Export Citation:
Assignee:
SAMSUNG TECHWIN CO LTD (KR)
International Classes:
F28F9/00; F28F9/007
Foreign References:
| JPS5713989U | 1982-01-25 | |||
| KR20120003351U | 2012-05-15 | |||
| US20130264031A1 | 2013-10-10 | |||
| US20030196781A1 | 2003-10-23 | |||
| US7854254B2 | 2010-12-21 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
리앤목 특허법인 (KR)
리앤목 특허법인 (KR)
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